AM29DS323D datasheet(54/54 Pages) AMD

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Am29DS323D

P R E L I M I NARY

REVISION SUMMARY

Revision A (December 1, 1999)

Released page 1 only.

Publication Number 23480, Revision A

(January 25, 2000)

Released as full data sheet. The publication number

has been changed from 22394 to 23480.

Revision A+1 (June 16, 2000)

Global

The 100 ns speed option has been replaced by a 110

ns option.

The data sheet status has changed from “Advance In-

formation” to “Preliminary.”

Ordering Information

In the ordering part number, changed FBGA package

code to WM. For 6 x 12 FBGA packages only, the

physical marking for regulated voltage range devices

is now “Q” and the physical marking for full voltage

range devices is now “U.”

Ordering Information

Optional processing: Deleted the burn-in option.

DC Characteristics table

CMOS Compatible: Changed maximum specification

on V

LKO to 1.6 V.

AC Characteristics—Read-Only Operations

Changed t

DF to 16 ns from 30 ns.

AC Characteristics—Data Polling and Toggle Bit

Added table. Timing specifications for data polling and

toggle bit operations differ from those for memory

array read operations.

AC Characteristics—Erase and Program

Operations table; Alternate CE# Controlled Erase

and Program Operations table

Changed typical and maximum byte and word pro-

gramming times to match changes in erase and

program performance table.

Erase and Program Performance

Changed the following specifications: typical and max-

imum byte program time, typical and maximum word

program time, typical and maximum chip program time

for both word and byte modes.

Revision A+2 (November 1, 2000)

Global

Deleted “contact AMD for availability” notes for TSOP

package. Added TSOP valid combinations to the Or-

dering Information section. In Tables 7 and 14,

changed data for SecSi Sector Factory Protect to 85h

(factory locked) and 05h (not factory locked).

Revision A+3 (November 22, 2000)

Removed Preliminary status from document.

Table 4, SecSi

™ Sector Addresses for Top Boot De-

vices. Table 6, SecSi

™ Sector Addresses for Bottom

Boot Devices: Added ESN addresses to tables.

Fa c t or y L o c k e d: S e c S i Se c t o r P r ogra m m e d

and Protected at the Factory: Corrected ESN address

range.

Autoselect Command Sequence: Added table to clar-

ify explanation of autoselect codes.

Trademarks

AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.

ExpressFlash is a trademark of Advanced Micro Devices, Inc.

Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.

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