Document Number: 001-98296 Rev. *J

Page 9 of 19

S70GL02GS

3.1

Special Handling Instructions for BGA Package

Special handling is required for Flash Memory products in BGA packages.

Flash memory devices in BGA packages may be damaged if exposed to ultrasonic cleaning methods. The package and/or data

integrity may be compromised if the package body is exposed to temperatures above 150°C for prolonged periods of time.

Figure 4. 64-ball Fortified Ball Grid Array

Notes

1. Ball E1, Do Not Use (DNU), a device internal signal is connected to the package connector. The connector may be used by Cypress for test or other purposes and is

not intended for connection to any host system signal. Do not use these connections for PCB Signal routing channels. Though not recommended, the ball can be

2. Balls F7 and G1, Reserved for Future Use (RFU).

3. Balls A1, A8, C1, D1, H1, and H8, No Connect (NC).

64-ball Fortified BGA

Top View, Balls Facing Down

A2

C2

D2

E2

F2

G2

H2

A3

C3

D3

E3

F3

G3

H3

A4

C4

D4

E4

F4

G4

H4

A5

C5

D5

E5

F5

G5

H5

A6

C6

D6

E6

F6

G6

H6

A7

C7

D7

E7

F7

G7

H7

DQ15

RFU

A16

A15

A14

A12

A13

DQ13

DQ6

DQ14

DQ7

A11

A10

A8

A9

DQ4

DQ12

DQ5

A19

A21

RESET#

WE#

DQ11

DQ3

DQ10

DQ2

A20

A18

WP#

RY/BY#

DQ9

DQ1

DQ8

DQ0

A5

A6

A17

A7

OE#

CE#

A0

A1

A2

A4

A3

A1

C1

D1

E1

F1

G1

H1

RFU

NC

DNU

NC

NC

A26

NC

A8

C8

B2

B3

B4

B5

B6

B7

B1

B8

D8

E8

F8

G8

H8

A25

NC

A24

A23

A22

NC