2004 Aug 06

4

Philips Semiconductors

Product specification

NPN resistor-equipped transistors;

R1 = 4.7 k

Ω, R2 = open

PDTC143T series

ORDERING INFORMATION

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).

Notes

1. Refer to standard mounting conditions.

2. Reflow soldering is the only recommended soldering method.

3. Refer to SOT883 standard mounting conditions; FR4 with 60

µm copper strip line.

TYPE NUMBER

PACKAGE

NAME

DESCRIPTION

VERSION

PDTC143TE

−

plastic surface mounted package; 3 leads

SOT416

PDTC143TEF

−

plastic surface mounted package; 3 leads

SOT490

PDTC143TK

−

plastic surface mounted package; 3 leads

SOT346

PDTC143TM

−

leadless ultra small plastic package; 3 solder lands; body

1.0

× 0.6 × 0.5 mm

SOT883

PDTC143TS

−

plastic single-ended leaded (through hole) package; 3 leads

SOT54

PDTC143TT

−

plastic surface mounted package; 3 leads

SOT23

PDTC143TU

−

plastic surface mounted package; 3 leads

SOT323

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

collector-base voltage

open emitter

−

50

V

collector-emitter voltage

open base

−

50

V

emitter-base voltage

open collector

−

5V

output current (DC)

−

100

mA

collector current

−

100

mA

total power dissipation

SOT54

note 1

−

500

mW

SOT23

note 1

−

250

mW

SOT346

note 1

−

250

mW

SOT323

note 1

−

200

mW

SOT490

notes 1 and 2

−

250

mW

SOT883

notes 2 and 3

−

250

mW

SOT416

note 1

−

150

mW

storage temperature

−65

+150

°C

junction temperature

−

150

°C

operating ambient

temperature

−65

+150

°C