AD558

REV.

B

–3–

ABSOLUTE MAXIMUM RATINGS*

Digital Inputs (Pins 1–10) . . . . . . . . . . . . . . . . . . 0 V to +7.0 V

Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . 450 mW

Storage Temperature Range

N/P (Plastic) Packages . . . . . . . . . . . . . . . . –25

°C to +100°C

D (Ceramic) Package . . . . . . . . . . . . . . . . . –55

°C to +150°C

Lead Temperature (soldering, 10 sec) . . . . . . . . . . . . . +300

°C

Thermal Resistance

Junction to Ambient/Junction to Case

D (Ceramic) Package . . . . . . . . . . . . . . 100

°C/W/30°C/W

N/P (Plastic) Packages . . . . . . . . . . . . . 140

°C/W/55°C/W

*Stresses greater than those listed under “Absolute Maximum Ratings” may cause

permanent damage to the device. This is a stress rating only and functional

operation of the device at these or any other conditions above those indicated in the

operational section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

AD558 METALIZATION PHOTOGRAPH

Dimensions shown in inches and (mm).

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

AD558

TOP VIEW

(Not to Scale)

GND

GND

CS

(LSB) DB0

DB1

DB2

DB3

DB4

DB5

DB6

(MSB) DB7

CE

Figure 1a. AD558 Pin Configuration (DIP)

AD558

TOP VIEW

(Not to Scale)

1

2

3

20 19

9 10 11 12 13

4

5

7

6

8

18

17

16

15

14

GND

NC

GND

DB2

DB3

DB4

DB5

NC

NC = NO CONNECT

Figure 1b. AD558 Pin Configuration (PLCC and LCC)

Bond Pad Coordinates

Pad No.

Pad Name

X Coordinate

Y Coordinate

1

DB

0

−702

1265

DB

1

2

−927

1265

DB

2

3

−957

1004

4

DB

3

−957

347

5

DB

4

−957

115

6

DB

5

−957

−111

7

DB

6

−927

−1248

8

DB

7

−702

−1248

9

CE

−1248

47

10

CS

272

−1248

11

957

−1225

12

2

G

ND

957

−965

13

3

G

ND

946

970

14

923

1265

15

689

1265

16

−461

1265