IS22C012

4

Integrated Silicon Solution, Inc. — 1-800-379-4774

ADVANCE INFORMATION VP010-0B

02/24/99

PIN DESCRIPTION

OUT1

Programmable output 1

OUT2

Programmable output 2

OUT3

Programmable output 3

PWM audio signal output for buzzer and speaker

PWM audio signal output for buzzer and speaker

GND

Power ground

Current output from internal DAC for speaker playback

OSC

Oscillator resistor pin to control sampling frequency

Program power supply, no connect when voice playback

S1

Trigger switch 1, internal pull low, active high

S2

Trigger switch 2, internal pull low, active high

Positive power supply

S3

Trigger switch 3, internal pull low, active high

S4

Trigger switch 4, internal pull low, active high

SBT

Sequential trigger, internal pull low, active high

IRP

Interrupt to stop playback, internal pull low, active high

Note:

1. The following pins are used to program data into the memory: pins 4, 5, 6,

8, 9, 12, 15 and 16.

BONDING PARAMETERS

Pin

Name

X

Y

1

OUT1

204

–678

423

–678

718

–678

4

GND

893

–678

5

OUT2

786

677

6

OUT3

590

677

167

677

8

OSC

–89

677

–306

677

10

S1

–483

677

11

S2

–691

677

12

–899

677

13

S3

–796

–678

14

S4

–588

–678

15

SBT

–380

–678

16

IRP

–172

–678

BONDING DIAGRAM

Note: Programming requires connection to

pins 4, 5, 6, 8, 9, 12, 15, and 16.

PIN CONFIGURATIONS

300-mil PDIP

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

OUT1

GND

OUT2

OUT3

OSC

IRP

SBT

S4

S3

S2

S1

12

11

10

9

8

7

6

5

13

14

15

16

2

4

13

NC

NC

(0,0)

X

Y

Note: Substrate must be connected to GND

Pad size = 80

µm x 80 µm

Die size = 2128 x 1635

µm

83.78 x 64.37 mil