VCNT2020

www.vishay.com

Vishay Semiconductors

Rev. 1.1, 19-Jan-18

4

Document Number: 84285

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Fig. 10 - Relative Collector Current vs. Displacement

Fig. 11 - Rise / Fall Time vs. Collector Current

FLOOR LIFE

Time between soldering and removing from MBB must not

exceed the time indicated in J-STD-020:

Moisture sensitivity: level 4

Floor life: 72 h

DRYING

In case of moisture absorption devices should be baked

before

soldering.

Conditions

see

J-STD-020

or

recommended conditions:

192 h at 40 °C (+ 5 °C), RH < 5 %

or

96 h at 60 °C (+ 5 °C), RH < 5 %

REFLOW SOLDER PROFILE

Fig. 12 - Lead (Pb)-free Reflow Solder Profile

According to J-STD-020

0

10

20

30

40

50

60

70

80

90

100

110

0

0.25 0.5 0.75 1.00 1.25 1.50

2.25

s - Displacement (mm)

y - direction

x - direction

1.75 2.00

2.5

0

10

20

30

40

50

60

70

80

90

100

0

500

2000

U

λ = 960 nm

R

1000

1500

t

r

t

f

240 °C

Max. 260 °C

217 °C

255 °C

19841

10

100

1000

10000

0

100

200

300

0

50

100

150

200

300

Axis Title

Time (s)

50

150

250

250

245 °C

Max. 100 s

Max. 30 s

Max. 120 s

Max. ramp down 6 °C/s

Max. ramp up 3 °C/s