OVTL09LG3G datasheet(12/14 Pages) TTELEC

12 / 14 page

Issue B.2 07/08

Page 12 of 14

OPTEK reserves the right to make changes at any time in order to improve design and to supply the best product possible.

OPTEK Technology Inc. —

1645 Wallace Drive, Carrollton, Texas 75006

Phone: (972) 323-2200 or (800) 341-4747 FAX: (972) 323-2396 visibleLED@optekinc.com www.optekinc.com

Lednium Series Optimal X

OVTL09LG3x Series

Typical elements in the conducting path and corresponding nominal thermal conductivities are:

Elements

w/mK

Epilayers

GaN/InGaN

150

Substrate

Sapphire

Die attach material

Conductive epoxy

Package

Silver plated copper

350

Solder

Solder (Sn/Ag/Cu)

Copper cladding

Copper

300

Note : Thermal conductivity is a physical constant. For the materials above, the respective contribution each makes

to the overall thermal resistance (R

θ j-b) is a function of the thickness of each material layer, and the surface area.

Thermal Conductivity (TC) is defined to be the heat conducted in time (t), through thickness (T) in a direction normal

to a surface area (A), due to a temperature difference (

δT).

Therefore

TC= q/t x {T/[A x

δT]}

and

δT = [Q x T]/[A x TC]

where

δT = Temp. difference (K)

Q = Power (w)

A = Surface area (m2)

T = layer thickness (m)

TC = Thermal Conductivity (w/mK)

Theoretical Calculation (for 1 watt dissipated in a cup product via a single 40mil die)

GaN

Thickness approx 10 x 10-6

= 1 x 10x10-6/ 10-6 x 150

Area 10-6

= 0.07 K

Substrate

T = 60 x 10-6

= 1 x 60x10-6/ 10-6 x 50

= 1.2 K

Die attach

T = 20 x 10-6

= 1 x 20x10-6 / 2x10-6 x 10

A = 2 x 10-6

= 1

Package

T = 0.4x10-3

= 1 x 0.4x10-3/ 6x10-6 x 350

A = 6x10-6

= 0.19

Solder

T = 60x10-6

= 1 x 60x10-6/6x10-6 x 25

A = 6x10-6

= 0.4

Total Calculated

δT = 2.86K

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