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SC14CVMDECT-SF датащи(PDF) 52 Page - Dialog Semiconductor

номер детали SC14CVMDECT-SF
подробное описание детали  Cordless Voice Module
PDF  57 Pages
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производитель  DIALOG [Dialog Semiconductor]
домашняя страница  http://www.dialog-semiconductor.com/
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SC14CVMDECT-SF датащи(HTML) 52 Page - Dialog Semiconductor

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Datasheet
Revision 3.0
28-Jul-2015
CFR0011-120-00-FM Rev 5
52 of 57
© 2013 Dialog Semiconductor
SC14CVMDECT SF
Cordless Voice Module
FINAL
11.0 Package information
11.1 SOLDERING PROFILE
The SC14CVMDECT SF should be soldered using a
lead-free reflow soldering profile as shown below.
Adjustments to the profile may be necessary depend-
ing on process requirements.
Recommended solder paste for lead-free soldering:
Sn 96.5 % - Ag 3.0 % - Cu 0.5 %.
11.2 MOISTURE SENSITIVITY LEVEL (MSL)
The MSL is an indicator for the maximum allowable
time period (floor life time) in which a moisture sensi-
tive plastic device, once removed from the dry bag, can
be exposed to an environment with a maximum tem-
perature of 30°C and a maximum relative humidity of
60% RH. before the solder reflow process.
The SC14CVMDECT SF is qualified to MSL 3.
Figure 39: Reflow profile (lead-free)
Time
217 °C
25 °C
Slope: 1~2 °C/s max.
(217 °C to peak)
Ramp down rate:
max. 3 °C/s
Peak temperature:
250 °C +5/-0 °C
245 °C
Temperature
>30 s
60 ~ 150 s
60 ~ 120 s
Preheat:
150 ~ 200 °C
MSL Level
Floor Life Time
MSL 4
72 hours
MSL 3
168 hours
MSL 2A
4 weeks
MSL 2
1 year
MSL 1
Unlimited at 30 °C/85 % RH



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