FDMF5839 datasheet(2/30 Pages) ONSEMI

2 / 30 page

December 2016

www.fairchildsemi.com

FDMF5839 • Rev. 1.9

www.onsemi.com

FDMF5839 – Smart Power Stage (SPS) Module

with Integrated Thermal Warning and Thermal Shutdown

Features

 Ultra-Compact 5 mm x 5 mm PQFN Copper-Clip

Package with Flip Chip Low-Side MOSFET

 High Current Handling: 35 A

 3-State 5 V PWM Input Gate Driver

 Dynamic Resistance Mode for Low-Side Drive

(LDRV) Slows Low-Side MOSFET during Negative

Inductor Current Switching

 Auto DCM (Low-Side Gate Turn Off) Using

ZCD# Input

 Thermal Warning (THWN#) to Warn Over-

Temperature of Gate Driver IC

 Thermal Shutdown (THDN)

 HS-Short Detect Fault# / Shutdown

 Dual Mode Enable / Fault# Pin

 Internal Pull-Up and Pull-Down for ZCD# and

EN Inputs, respectively

 Fairchild PowerTrench® MOSFETs for Clean

Voltage Waveforms and Reduced Ringing

 Fairchild SyncFET™ Technology (Integrated

Schottky Diode) in Low-Side MOSFET

 Integrated Bootstrap Schottky Diode

 Optimized / Extremely Short Dead-Times

 Under-Voltage Lockout (UVLO) on VCC

 Optimized for Switching Frequencies up to 1.5 MHz

 PWM Minimum Controllable On-Time: 30 ns

 Low Shutdown Current: < 3 µA

 Optimized FET Pair for Highest Efficiency:

10 ~ 15% Duty Cycle

 Operating Junction Temperature Range:

-40°C to +125°C

 Fairchild Green Packaging and RoHS Compliance

 Automotive Qualified to AEC-Q100 (F085 version)

Description

The SPS family is Fairchild’s next-generation, fully

optimized, ultra-compact, integrated MOSFET plus

driver power stage solution for high-current, high-

frequency, synchronous buck, DC-DC applications. The

FDMF5839 integrates a driver IC with a bootstrap

Schottky diode, two power MOSFETs, and a thermal

monitor into a thermally enhanced, ultra-compact 5 mm

x 5 mm package.

With an integrated approach, the SPS switching power

stage is optimized for driver and MOSFET dynamic

performance, minimized system inductance, and power

MOSFET RDS(ON). The SPS family uses Fairchild's high-

performance

PowerTrench®

MOSFET

technology,

which reduces switch ringing, eliminating the need for a

snubber circuit in most buck converter applications.

A driver IC with reduced dead times and propagation

delays further enhances the performance. A thermal

warning function warns of a potential over-temperature

situation. A thermal shutdown function turns off the

driver if an over-temperature condition occurs. The

FDMF5839 incorporates an Auto-DCM Mode (ZCD#) for

improved light-load efficiency. The FDMF5839 also

provides a 3-state 5 V PWM input for compatibility with

a wide range of PWM controllers.

Applications

 Notebook, Tablet PC and Ultrabook

 Servers and Workstations, V-Core and Non-V-Core

DC-DC Converters

 Desktop and All-in-One Computers, V-Core and

Non-V-Core DC-DC Converters

 High-Performance Gaming Motherboards

 High-Current DC-DC Point-of-Load Converters

 Networking and Telecom Microprocessor Voltage

Regulators

 Small Form-Factor Voltage Regulator Modules

 Automotive-qualified Systems (F085 version)

Ordering Information

Part Number

Current Rating

Package

Top Mark

FDMF5839

35 A

31-Lead, Clip Bond PQFN SPS, 5.0 mm x 5.0 mm Package

5839

FDMF5839_F085

35 A

31-Lead, Clip Bond QFN SPS, 5.0 mm x 5.0 mm Package

TBD

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