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SN74LVC1G06

SCES295Z – JUNE 2000 – REVISED NOVEMBER 2017

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Copyright © 2000–2017, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 3

6

Specifications......................................................... 4

6.1

Absolute Maximum Ratings ...................................... 4

6.2

ESD Ratings ............................................................ 4

6.3

Recommended Operating Conditions ...................... 5

6.4

Thermal Information .................................................. 5

6.5

Electrical Characteristifcs.......................................... 6

6.6

Switching Characteristics: –40°C to +85°C............... 6

6.7

Switching Characteristics: –40°C to +125°C............. 6

6.8

Operating Characteristics.......................................... 6

6.9

Typical Characteristics .............................................. 7

7

Parameter Measurement Information .................. 8

8

Detailed Description .............................................. 9

8.1

Overview ................................................................... 9

8.2

Functional Block Diagram ......................................... 9

8.3

Feature Description................................................... 9

8.4

Device Functional Modes........................................ 10

9

Application and Implementation ........................ 11

9.1

Application Information............................................ 11

9.2

Typical Application ................................................. 11

10

Power Supply Recommendations ..................... 13

11

Layout................................................................... 13

11.1

Layout Guidelines ................................................. 13

11.2

Layout Example .................................................... 13

12

Device and Documentation Support ................. 14

12.1

Receiving Notification of Documentation Updates 14

12.2

Community Resources.......................................... 14

12.3

Trademarks ........................................................... 14

12.4

Electrostatic Discharge Caution ............................ 14

12.5

Glossary ................................................................ 14

13

Mechanical, Packaging, and Orderable

Information ........................................................... 14

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision Y (February 2017) to Revision Z

Page

•

Changed values in the Thermal Information table to align with JEDEC standards ............................................................... 5

•

Updated Feature Description to include more detailed information about specific device features. ..................................... 9

•

Added DPW layout example ................................................................................................................................................ 13

Changes from Revision X (August 2015) to Revision Y

Page

•

Changed Logic Diagram (Positive Logic) labels from: A-1, Y-3 to: A-2, Y-4.......................................................................... 1

•

Added Receiving Notification of Documentation Updates section ....................................................................................... 14

Changes from Revision W (December 2013) to Revision X

Page

•

Added Device Information table, Pin Configuration and Functions section, ESD Ratings table, Thermal Information

table, Typical Characteristics section, Feature Description section, Device Functional Modes, Application and

Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation

Support section, and Mechanical, Packaging, and Orderable Information section ............................................................... 1

Changes from Revision V (November 2012) to Revision W

Page

•

Updated document to new TI data sheet format. ................................................................................................................... 1

•

Removed Ordering Information table. .................................................................................................................................... 1

•

•

Updated operating temperature range. .................................................................................................................................. 5