MCP1630 COUPLED INDUCTOR BOOST

CONVERTER DEMO BOARD USER’S GUIDE

© 2006 Microchip Technology Inc.

DS51612A-page iii

Table of Contents

Preface ........................................................................................................................... 1

Introduction............................................................................................................ 1

Document Layout .................................................................................................. 1

Conventions Used in this Guide ............................................................................ 2

Recommended Reading........................................................................................ 2

The Microchip Web Site ........................................................................................ 3

Customer Support ................................................................................................. 3

Document Revision History ................................................................................... 3

Chapter 1. Product Overview ....................................................................................... 5

1.1 Introduction ..................................................................................................... 5

1.2 What is the MCP1630 Coupled Inductor Boost Converter Demo Board? ...... 6

1.3 What The MCP1630 Coupled Inductor Boost Converter Demo Board

Kit Includes ..................................................................................................... 6

Chapter 2. Installation and Operation ......................................................................... 7

2.1 Introduction ..................................................................................................... 7

2.2 Features ......................................................................................................... 7

2.3 Getting Started ............................................................................................... 8

Appendix A. Schematic and Layouts ........................................................................ 11

A.1 Introduction .................................................................................................. 11

A.2 Board – Schematic

................................................................................... 12

A.3 Board – Top Silk Layer ............................................................................... 13

A.4 Board – Top Metal Layer ............................................................................ 14

A.5 Board – Bottom Metal Layer

..................................................................... 15

Appendix B. Bill Of Materials (BOM) ......................................................................... 17

Appendix C. Demo Board Firmware .......................................................................... 19

C.1 Device Firmware .......................................................................................... 19

Worldwide Sales and Service .................................................................................... 22