| производитель | номер детали | датащи | подробное описание детали |
Vishay Siliconix |
84063
|
609Kb / 5P |
The Constituents of Semiconductor Components
07-Jan-03 |
M/A-COM Technology Solu... |
ANI-019
|
588Kb / 6P |
Tape & Reel Packaging and Orientation for Surface Mount Components
|
|
M513
|
496Kb / 28P |
Tape and Reel Packaging for Surface Mount Components
|
Samsung semiconductor |
CIG22L1R0MNE
|
4Mb / 31P |
MULTILAYER CHIP COMPONENTS
|
Johanson Technology Inc... |
L-14C39NJV4T
|
191Kb / 2P |
Chip and Wirewound Inductor Packaging Information
|
M/A-COM Technology Solu... |
ANI-019
|
288Kb / 7P |
Tape & Reel Packaging and Orientation for Surface Mount Components
|
PHOENIX CONTACT |
2201759
|
43Kb / 2P |
Components of electronic housing
|
Amphenol Corporation |
P-UE86-3G8620-X0X61
|
1,009Kb / 5P |
PACKAGING: TRAY PACKAGING
|
Aries Electronics, Inc. |
800
|
723Kb / 1P |
DIP Packaging of LEDs, Incandescent Lamps, DIP Switches
|
PHOENIX CONTACT |
2906911
|
54Kb / 2P |
Components of electronic housing - ME LPZS
|
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