| производитель | номер детали | датащи | подробное описание детали |
 Hirose Electric |
HP5-189P-1.27W
|
1Mb / 34P |
High-density Packaging System
|
 Molex Electronics Ltd. |
86275
|
161Kb / 2P |
High Density MT Cable Assemblies
|
|
86086-5200
|
218Kb / 3P |
MTP Backplane Interconnect System (BMTP)
|
|
106186-0017
|
476Kb / 2P |
MTP* Backplane Interconnect System (BMTP)
|
|
106601-1050
|
1Mb / 2P |
VITA 66.1 Ruggedized Optical MT Backplane Interconnect System
|
 Tyco Electronics |
1410142-1
|
494Kb / 6P |
High Speed Backplane Interconnect Solutions
|
 Molex Electronics Ltd. |
1061051100
|
42Kb / 1P |
HBMT High Density Backplane Daughtercard Connector Housing
|
|
1061052000
|
42Kb / 1P |
HBMT High Density Backplane Motherboard Adapter Housing
|
 Samtec, Inc |
HDLSP-035-1000
|
396Kb / 1P |
HIGH-DENSITY/HIGH-SPEED CABLE SYSTEM
|
 Linx Technologies |
MDEV-LICAL-MT
|
3Mb / 11P |
MT Series Master Development System
|