| производитель | номер детали | датащи | подробное описание детали |
STATS ChipPAC, Ltd. |
QFP-EP
|
117Kb / 2P |
Exposed Pad Quad Flat Pack
|
Delta Electronics, Inc. |
IPM04C0A0R
|
741Kb / 15P |
Copper pad to provide excellent thermal performance
|
TE Connectivity Ltd |
408-32122
|
478Kb / 4P |
The die assembly features an anvil die and a crimper die
|
T-Global Technology |
TG-A1250LC
|
289Kb / 1P |
High Performance Thermal Pad
Version18 20221122 |
|
TG-ALC
|
295Kb / 1P |
High Performance Thermal Pad
Version 18 20220718 |
|
TG-A6200LC
|
315Kb / 1P |
High Performance Thermal Pad
Version18 20221026 |
|
TG-A20KF
|
514Kb / 1P |
High Performance Thermal Pad
20230721 |
|
TG-A20KX
|
506Kb / 1P |
High Performance Thermal Pad
20230721 |
|
TG-A38KF
|
505Kb / 1P |
High Performance Thermal Pad
20230721 |
|
TG-A38KX
|
509Kb / 1P |
High Performance Thermal Pad
20230721 |
Russian ▼ 
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
