| производитель | номер детали | датащи | подробное описание детали |
Infineon Technologies A... |
CYW920820M2EVB-01
|
4Mb / 4P |
AIROC CYW20820 Bluetooth and Bluetooth® LE system on chip evaluation kit
05 / 2022 |
Toshiba Semiconductor |
TC35667FTG-006
|
575Kb / 41P |
TC35667FTG-006 TC35667FSG-006 Bluetooth® LE Single IC
2017-04-07 Rev 2.2 |
|
TC35670FTG-006
|
1,014Kb / 69P |
TC35670FTG-006 Bluetooth® Smart NFC Tag IC
2016-05-31 Rev 2.1 |
Infineon Technologies A... |
CYW20819
|
508Kb / 52P |
AIROC™ Bluetooth® & Bluetooth® LE system-on-chip Ultra low power, Bluetooth® 5.2
Rev. G 2022-07-13 |
|
CYW20820
|
631Kb / 59P |
AIROC™ Bluetooth® and Bluetooth® LE system on chip
Rev. G 2022-09-26 |
Silicon Laboratories |
BT111
|
2Mb / 53P |
Bluetooth® Smart Ready HCI Module
Version 1.27 |
Infineon Technologies A... |
CYBLE-343072-02
|
868Kb / 58P |
AIROC™ Bluetooth® LE module
2021-08-12 |
|
CYW20835
|
791Kb / 46P |
AIROC™ Bluetooth® LE system on chip
Rev. B 2023-01-18 |
|
CY8C63X6
|
2Mb / 108P |
PSoC™ 63 MCU with Bluetooth® LE
Rev. R 2023-05-10 |
ESPRESSIF SYSTEMS (SHAN... |
ESP32-WROOM-32E
|
1Mb / 33P |
2.4 GHz WiFi Bluetooth® Bluetooth LE module
2023 |
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