| производитель | номер детали | датащи | подробное описание детали |
 STMicroelectronics |
SSOP24
|
59Kb / 4P |
24-LEAD SHRINK SMALL OUTLINE PACKAGE
Nov-2002 |
 National Semiconductor ... |
MTC16
|
70Kb / 1P |
16 Lead Molded Thin Shrink Small Outline Package, JEDEC NS Package Number MTC16
|
|
MC16A
|
53Kb / 1P |
16 Lead Ceramic Small Outline Package NS Package Number MC16A
|
 Amkor Technology |
CSSOP
|
304Kb / 1P |
Ceramic Shrink Small Outline Package
|
 STMicroelectronics |
SO-8
|
56Kb / 5P |
8-LEAD SMALL OUTLINE PACKAGE
Feb-2005 |
 Advanced Power Electron... |
AP2301EN-HF
|
102Kb / 4P |
Small Package Outline
|
|
AP2301N-HF
|
65Kb / 4P |
Small Package Outline
|
|
AP2306AGEN-HF
|
101Kb / 4P |
Small Outline Package
|
|
AP2318AGEN-HF
|
64Kb / 4P |
Small Outline Package
|
|
AP2323AGN-HF
|
104Kb / 4P |
Small Package Outline
|