FUSIONQUAD датащи(PDF) - Amkor Technology

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FUSIONQUAD датащи (PDF) - Amkor Technology

FUSIONQUAD Datasheet PDF - Amkor Technology


номер детали	FUSIONQUAD

скачать	FUSIONQUAD скачать

объем файла	394.04 Kbytes

Page	2 Pages

производитель	AMKOR [Amkor Technology]

домашняя страница	http://www.amkor.com

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подробное описание детали

Increased I/O (116 to 356) in smaller package footprints

FUSIONQUAD Datasheet (PDF)

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скачать датащи

FUSIONQUAD Datasheet PDF - Amkor Technology


номер детали	FUSIONQUAD

скачать	FUSIONQUAD Click to download

объем файла	394.04 Kbytes

Page	2 Pages

производитель	AMKOR [Amkor Technology]

домашняя страница	http://www.amkor.com

Logo

подробное описание детали	Increased I/O (116 to 356) in smaller package footprints

FUSIONQUAD датащи (HTML) - Amkor Technology

FUSIONQUAD Datasheet HTML 1Page - Amkor Technology

FUSIONQUAD Datasheet HTML 2Page - Amkor Technology

Аналогичный номер детали - FUSIONQUAD

производитель	номер детали	датащи	подробное описание детали
Synaptics Incorporated.	FUSION878A	50Kb / 1P	TELETEXT Application for Conexant Fusion 878A PCI Video Capture Processor

Аналогичное описание - FUSIONQUAD

производитель	номер детали	датащи	подробное описание детали
List of Unclassifed Man...	SAA1094	306Kb / 1P	Tone Ringer IC (14-Pin Plastic Package TO-116)
Global Mixed-mode Techn...	G1214A	306Kb / 1P	Rail-to-Rail I/O
Advanced Power Electron...	AP2626GY-HF	66Kb / 4P	Simple Drive Requirement, Smaller Outline Package
Littelfuse	NGD18N45CLB	279Kb / 8P	DPAK Package Offers Smaller Footprint for Increased Board Space
Shindengen Electric Mfg...	D30XT80	465Kb / 4P	Large I o Single In-line Package
Shindengen Electric Mfg...	D50XB80	437Kb / 4P	Large I o Single In-line Package
M-System Co.,Ltd.	R10M-CT4E	365Kb / 7P	Plug-in Remote I/O R10 Series MODBUS I/O MODULE
M-System Co.,Ltd.	R10M-US2	401Kb / 8P	Plug-in Remote I/O R10 Series MODBUS I/O MODULE
Black Box Registered Tr...	ED-549	1Mb / 6P	Ethernet to Analogue I/O
Black Box Registered Tr...	ED-560	1Mb / 6P	Ethernet to Analogue I/O

О Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*Эта информация предназначена только для общих информационных целей, мы не несем ответственности за любые убытки или ущерб, вызванные вышеуказанной информацией.

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