SO8-FL датащи(PDF) - Amkor Technology

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SO8-FL датащи (PDF) - Amkor Technology

SO8-FL Datasheet PDF - Amkor Technology


номер детали	SO8-FL

скачать	SO8-FL скачать

объем файла	744.46 Kbytes

Page	2 Pages

производитель	AMKOR [Amkor Technology]

домашняя страница	http://www.amkor.com

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подробное описание детали

Interconnect - Cu clips technology for better electrical and thermal

SO8-FL Datasheet (PDF)

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скачать датащи

SO8-FL Datasheet PDF - Amkor Technology


номер детали	SO8-FL

скачать	SO8-FL Click to download

объем файла	744.46 Kbytes

Page	2 Pages

производитель	AMKOR [Amkor Technology]

домашняя страница	http://www.amkor.com

Logo

подробное описание детали	Interconnect - Cu clips technology for better electrical and thermal

SO8-FL датащи (HTML) - Amkor Technology

SO8-FL Datasheet HTML 1Page - Amkor Technology

SO8-FL Datasheet HTML 2Page - Amkor Technology

Аналогичный номер детали - SO8-FL

производитель	номер детали	датащи	подробное описание детали
Amkor Technology	SO8-FL-V01	676Kb / 2P	This package is available in both JEDEC and JEITA package outlines. 02/21

Аналогичное описание - SO8-FL

производитель	номер детали	датащи	подробное описание детали
Intel Corporation	PXA270	1Mb / 126P	Electrical, Mechanical, and Thermal Specification
Littelfuse	354	100Kb / 1P	Fuse Blocks and Clips - For 3AG Fuses
Intel Corporation	LUPXA255A0C200	1Mb / 40P	Electrical, Mechanical, and Thermal Specification
	GDPXA255A0E400	1Mb / 40P	Electrical, Mechanical, and Thermal Specification
	LUPXA255A0E400	1Mb / 40P	Intel짰 PXA255 Processor Electrical, Mechanical, and Thermal Specification
	NHPXA270C5C312	1Mb / 126P	Electrical, Mechanical, and Thermal Specification
International Rectifier	IRFB4019PBF	287Kb / 8P	Low QRR for Better THD and Lower EMI
GOOD-ARK Electronics	GDSSF2301B	293Kb / 4P	TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
Amkor Technology	SOD323-FL	459Kb / 2P	Interconnect - Cu clips technology for better electrical and thermal
Axiomtek Co., Ltd.	NA560	234Kb / 1P	Smart Fan for better thermal and acoustic performance

О Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*Эта информация предназначена только для общих информационных целей, мы не несем ответственности за любые убытки или ущерб, вызванные вышеуказанной информацией.

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