| производитель | номер детали | датащи | подробное описание детали |
 Maxim Integrated Produc... |
21-0136F
|
55Kb / 2P |
PACKAGE OUTLINE 12,16L THIN QFN, 3x3x0.8mm
Rev F |
 fujitsu semiconductor |
FPT-20P-M04
|
37Kb / 1P |
THIN SHRINK SMALL OUTLINE PACKAGE
|
 Maxim Integrated Produc... |
21-0093
|
38Kb / 1P |
PACKAGE OUTLINE, 9 BUMPS, 3*3 ARRAY, UCSP(B)PKG.
Rev M |
|
21-0104
|
40Kb / 1P |
PACKAGE OUTLINE, 12BUMPS, 3*4ARRAY, UCSP(B)PKG.
Rev G |
|
21-0491
|
52Kb / 1P |
PACKAGE OUTLINE 16 BUMPS WLP PKG. 0.4MM PITCH
REV .G |
|
21-0542
|
52Kb / 1P |
PACKAGE OUTLINE 12 BUMPS, WLP PKG, 0.4MM PITCH
REV .C |
|
21-0548
|
47Kb / 1P |
PACKAGE OUTLINE 30 BUMPS, WLP PKG. 0.4MM PITCH
REV .D |
|
21-0576
|
56Kb / 2P |
PACKAGE OUTLINE, 20L 4*4*0.85MM QFN PKG, WITH DIMPLE LEADS
REV .A |
|
21-0577
|
55Kb / 1P |
PACKAGE OUTLINE, 28 BUMPS WLP PKG. (HIGH CURRENT) O.5MM PITCH
REV .A |
 P-tec Corporation |
PL00133-WCA03
|
31Kb / 1P |
Dome lens thin package 1.6 x 0.8 x 0.4mm
|