FEATURES

• Superectifier structure for high reliability application

• Cavity-free glass-passivated junction

• Low forward voltage drop

• Low leakage current, IR less than 0.1 μA

• High forward surge capability

• Meets environmental standard MIL-S-19500

• Solder dip 275 °C max. 10 s, per JESD 22-B106

• AEC-Q101 qualified

• Compliant to RoHS Directive 2002/95/EC and in accordance to WEEE 2002/96/EC