FEATURES
• Glass passivated chip junction
• 1500 W peak pulse power capability with a
   10/1000 µs waveform, repetitive rate (duty
   cycle): 0.01 %
• Excellent clamping capability
• Very fast response time
• Low incremental surge resistance
• Solder dip 260 °C, 40 s
• Component in accordance to RoHS 2002/95/EC
   and WEEE 2002/96/EC

TYPICAL APPLICATIONS
   Use in sensitive electronics protection against voltage
   transients induced by inductive load switching
   and lighting on ICs, MOSFET, signal lines of sensor
   units for consumer, computer, industrial and
   telecommunication.