DESCRIPTION
No-clean flux classified as type ORL0 according to J-STD-004B. Corresponds in composition to EF350.
Stannol 500-3431 is halide free activated. The new formula of the activators guarantees an optimum wetting of the different
surfaces (such as OSP, Ni/Au, HAL) used in PCB manufacturing and so avoids problems when new printed circuit boards with
alternative surfaces are introduced.
A low resin percentage (<0.2%) was integrated into the flux formulation in order to meet the requirements on the soldering
behavior of the flux and the electrical safety of the residues left after soldering.
APPLICATION
The Stannol 500-3431 has been developed for the application with spray fluxers. The preheat temperature should be at least
90° C measured on the surface of the circuit board when entering the solder wave. This temperature ensures the
evaporation of the solvent and a sufficient activation of the flux.
Evaporation of solvent can change the composition. Evaporation causes an increase of the solid content and therefore the
density increases. This can be checked with the Stannol Mini-Titration-Kit.