1.1 Features 1
• Embedded Power Controller
• Two Efficient Step-Down DC-DC Converters for
Processor Cores
• One Efficient Step-Down DC-DC Converter for I/O
Power
• One Efficient Step-Up 5-V DC-DC Converter
• SmartReflex™ Compliant Dynamic Voltage
Management for Processor Cores
• 8 LDO Voltage Regulators and One Real-Time
Clock (RTC) LDO (Internal Purpose)
• One High-Speed I2C Interface for General-Purpose
Control Commands (CTL-I2C)
• One High-Speed I2C Interface for SmartReflex
Class 3 Control and Command (SR-I2C)
• Two Enable Signals Multiplexed with SR-I2C,
Configurable to Control any Supply State and
Processor Cores Supply Voltage
• Thermal Shutdown Protection and Hot-Die
Detection
• An RTC Resource With:
– Oscillator for 32.768-kHz Crystal or 32-kHz
Built-in RC Oscillator
– Date, Time, and Calendar
– Alarm Capability
• One Configurable GPIO
• DC-DC Switching Synchronization Through
Internal or External 3-MHz Clock

1.2 Applications
• Portable and Handheld Systems
• Industrial Systems

1.3 Description
The TPS65910 device is an integrated power-management IC available in 48-QFN package and
dedicated to applications powered by one Li-Ion or Li-Ion polymer battery cell or 3-series Ni-MH cells, or
by a 5-V input; it requires multiple power rails. The device provides three step-down converters, one stepup
converter, and eight LDOs and is designed to support the specific power requirements of OMAP-based
applications.
Two of the step-down converters provide power for dual processor cores and are controllable by a
dedicated class-3 SmartReflex interface for optimum power savings. The third converter provides power
for the I/Os and memory in the system.
The device includes eight general-purpose LDOs providing a wide range of voltage and current
capabilities. The LDOs are fully controllable by the I2C interface. The use of the LDOs is flexible; they are
intended to be used as follows: Two LDOs are designated to power the PLL and video DAC supply rails
on the OMAP-based processors, four general-purpose auxiliary LDOs are available to provide power to
other devices in the system, and two LDOs are provided to power DDR memory supplies in applications
requiring these memories.
In addition to the power resources, the device contains an embedded power controller (EPC) to manage
the power sequencing requirements of the OMAP systems and an RTC.