1 Features
1• Complete Integrated Power Solution Allows
Small Footprint, Low-Profile Design
• 9 mm × 11 mm × 2.8 mm package
- Pin Compatible with LMZ30604 and LMZ30606
• Efficiencies Up To 96%
• Wide-Output Voltage Adjust
0.8 V to 3.6 V, with ±1% Reference Accuracy
• Adjustable Switching Frequency
(500 kHz to 2 MHz)
• Synchronizes to an External Clock
• Adjustable Slow-Start
• Output Voltage Sequencing / Tracking
• Power Good Output
• Programmable Undervoltage Lockout (UVLO)
• Output Overcurrent Protection
• Over Temperature Protection
• Operating Temperature Range: –40°C to 85°C
• Enhanced Thermal Performance: 12°C/W
• Meets EN55022 Class B Emissions
- Integrated Shielded Inductor
• Create a Custom Design Using the LMZ30602
With the WEBENCH® Power Designer

2 Applications
• Broadband & Communications Infrastructure
• Automated Test and Medical Equipment
• Compact PCI / PCI Express / PXI Express
• DSP and FPGA Point of Load Applications
• High Density Distributed Power Systems

3 Description
The LMZ30602 power module is an easy-to-use
integrated power solution that combines a 2-A DC/DC
converter with power MOSFETs, a shielded inductor,
and passives into a low profile, QFN package. This
total power solution requires as few as 3 external
components and eliminates the loop compensation
and magnetics part selection process.
The 9×11×2.8 mm QFN package is easy to solder
onto a printed circuit board and allows a compact
point-of-load design with greater than 90% efficiency
and excellent power dissipation with a thermal
impedance of 12°C/W junction to ambient. The
device delivers the full 2-A rated output current at
85°C ambient temperature without airflow.
The LMZ30602 offers the flexibility and the featureset
of a discrete point-of-load design and is ideal for
powering performance DSPs and FPGAs. Advanced
packaging technology afford a robust and reliable
power solution compatible with standard QFN
mounting and testing techniques.