1 Features
1• High Resolution 1080p (1920×1080) Array With
>2 Million Micromirrors
– 0.65-Inch Micromirror Array Diagonal
– 7.56 μm Micromirror Pitch
– ±12° Micromirror Tilt Angle (Relative to Flat
State)
– Designed for Corner Illumination
• Designed for Use With Broadband Visible Light
(400 nm – 700 nm)
– Window Transmission 97% (Single Pass,
Through Two Window Surfaces)
– Micromirror Reflectivity 88%
– Array Diffraction Efficiency 86%
– Array Fill Factor 92%
• Two 16-Bit, Low Voltage Differential Signaling
(LVDS), Double Data Rate (DDR) Buses
• Two Dedicated Controller Options at 400 MHz
Input Data Clock Rate
• DLPC900 Digital Controller
– Up to 9523 Hz (1-Bit Binary Patterns)
– Up to 19.7 Giga-bits Per Second (1-Bit Binary
Patterns)
– Up to 1031 Hz (8-Bit Gray Patterns Pre-
Loaded With Illumination Modulation), External
Input Up to 360 Hz
• DLPC910 Digital Controller
– Up to 11574 Hz (1-Bit Binary Patterns)
– Up to 24 Giga-bits Per Second (1-Bit Binary
Patterns)
– Up to 1446 Hz (8-Bit Gray Patterns With
Illumination Modulation)
• Integrated Micromirror Driver Circuitry
• Hermetic Package

2 Applications
• Industrial
– 3D Scanners for Machine Vision and Quality
Control
– 3D Printing
– Direct Imaging Lithography
– Laser Marking and Repair
• Medical
– Ophthalmology
– 3D Scanners for Limb and Skin Measurement
– Hyper-spectral Imaging
• Displays
– 3D Imaging Microscopes
– Intelligent and Adaptive Lighting

3 Description
Featuring over 2 million micromirrors in a hermetic
package, the high resolution 0.65 1080p digital
micromirror device (DMD) is a spatial light modulator
(SLM) that modulates the amplitude, direction, and/or
phase of incoming light. The unique capability and
value offered by the DLP6500, including operation at
405nm, makes it well suited to support a wide variety
of industrial, medical, and advanced imaging
applications. Reliable function and operation of the
DLP6500 requires that it be used in conjunction with
the DLPC900 or the DLPC910 digital controllers. This
dedicated chipset provides full HD resolution at high
speeds and can be easily integrated into a variety of
end equipment solutions.