QSOP датащи(PDF) - Amkor Technology

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QSOP датащи (PDF) - Amkor Technology

QSOP Datasheet PDF - Amkor Technology


номер детали	QSOP

скачать	QSOP скачать

объем файла	475.9 Kbytes

Page	2 Pages

производитель	AMKOR [Amkor Technology]

домашняя страница	http://www.amkor.com

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подробное описание детали

SSOP (Shrink Small-Outline Package) and QSOP (Quarter-Size Small Outline Package) are leadframe based, plastic encapsulated packages

QSOP Datasheet (PDF)

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скачать датащи

QSOP Datasheet PDF - Amkor Technology


номер детали	QSOP

скачать	QSOP Click to download

объем файла	475.9 Kbytes

Page	2 Pages

производитель	AMKOR [Amkor Technology]

домашняя страница	http://www.amkor.com

Logo

подробное описание детали	SSOP (Shrink Small-Outline Package) and QSOP (Quarter-Size Small Outline Package) are leadframe based, plastic encapsulated packages

QSOP датащи (HTML) - Amkor Technology

QSOP Datasheet HTML 1Page - Amkor Technology

QSOP Datasheet HTML 2Page - Amkor Technology

QSOP Информация о продукте

FEATURES
Cu wire interconnect for low cost
Standard JEDEC package outlines
Multi-die production capability
Turnkey test services, including strip test options
Green materials are standard – Pb-free and RoHS compliant
Stealth dicing (narrow saw streets)
Larger/Higher density leadframe strips
Leadframe roughening for improved MSL capability

Аналогичный номер детали - QSOP

производитель	номер детали	датащи	подробное описание детали
Amkor Technology	QSOP	433Kb / 2P	Shrink Small Outline, Quarter-Size Small-Outline Packages
TT Electronics.	QSOP	442Kb / 4P	RoHS compliant and Sn/Pb terminations available
Diodes Incorporated	QSOP-16	404Kb / 27P	SUGGESTED PAD LAYOUT Rev 52
Diodes Incorporated	QSOP-20	404Kb / 27P	SUGGESTED PAD LAYOUT Rev 52
Fairchild Semiconductor	QSOP-24	78Kb / 1P	Package MQA24

Аналогичное описание - QSOP

производитель	номер детали	датащи	подробное описание детали
STMicroelectronics	SSOP24	59Kb / 4P	24-LEAD SHRINK SMALL OUTLINE PACKAGE Nov-2002
fujitsu semiconductor	FPT-20P-M04	37Kb / 1P	THIN SHRINK SMALL OUTLINE PACKAGE
Amkor Technology	CSSOP	304Kb / 1P	Ceramic Shrink Small Outline Package
Analog Devices	RQ-16	60Kb / 1P	16-Lead Shrink Small Outline Package [QSOP] Dimensions shown in inches
ACCUTEK MICROCIRCUIT CO...	AK06D300-QSOP	174Kb / 4P	Quarter Size Small Outline Package QSOP DIP Adapters
ACCUTEK MICROCIRCUIT CO...	AK16D300	79Kb / 3P	Shrink Small Outline Package SSOP DIP Adapters
Advanced Power Electron...	AP2306AGEN-HF	101Kb / 4P	Small Outline Package
Advanced Power Electron...	AP2318AGEN-HF	64Kb / 4P	Small Outline Package
Amkor Technology	SSOP	433Kb / 2P	Shrink Small Outline, Quarter-Size Small-Outline Packages
Guangdong Youtai Semico...	LM75B	312Kb / 23P	plastic thin shrink small outline package; 8 leads;

О Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*Эта информация предназначена только для общих информационных целей, мы не несем ответственности за любые убытки или ущерб, вызванные вышеуказанной информацией.

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