FCCSP датащи(PDF) - Amkor Technology

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FCCSP датащи (PDF) - Amkor Technology

FCCSP Datasheet PDF - Amkor Technology


номер детали	FCCSP

скачать	FCCSP скачать

объем файла	119.83 Kbytes

Page	2 Pages

производитель	AMKOR [Amkor Technology]

домашняя страница	http://www.amkor.com

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подробное описание детали

a flip chip solution in a CSP package format.

FCCSP Datasheet (PDF)

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скачать датащи

FCCSP Datasheet PDF - Amkor Technology


номер детали	FCCSP

скачать	FCCSP Click to download

объем файла	119.83 Kbytes

Page	2 Pages

производитель	AMKOR [Amkor Technology]

домашняя страница	http://www.amkor.com

Logo

подробное описание детали	a flip chip solution in a CSP package format.

FCCSP датащи (HTML) - Amkor Technology

FCCSP Datasheet HTML 1Page - Amkor Technology

FCCSP Datasheet HTML 2Page - Amkor Technology

Аналогичный номер детали - FCCSP

производитель	номер детали	датащи	подробное описание детали
Amkor Technology	FCCSP	411Kb / 2P	Silver Wirebonding 02/22
Amkor Technology	FCCSP	953Kb / 2P	Amkor Technology offers the Flip Chip CSP (fcCSP) package – a flip chip solution in a CSP package format. 04/20

Аналогичное описание - FCCSP

производитель	номер детали	датащи	подробное описание детали
Semtech Corporation	SFC05-4	174Kb / 7P	CSP TVS Flip Chip TVS Diode Array
California Micro Device...	CSPRC030	44Kb / 3P	CHIP SCALE PACKAGE(CSP) EMI FILTER NETWORK
California Micro Device...	CSPRC032	44Kb / 3P	CHIP SCALE PACKAGE(CSP) EMI FILTER NETWORK
Cirrus Logic	CS98000	420Kb / 46P	DVD On-a-Chip Solution
Yamaichi Electronics Co...	NP284-26409N	82Kb / 1P	Chip Scale Package (CSP, 0.50mm Pitch)
Yamaichi Electronics Co...	NP383-18010-N	174Kb / 1P	Chip Scale Package -TH (CSP, 0.50mm Pitch)
Texas Instruments	SN74F574DWRE4	641Kb / 13P	Eight D-Type Flip-Flops in a Single Package
Formosa MS	QRDM-CSP01	905Kb / 1P	Flip Chip CSP DIODE
Lumileds Lighting Compa...	PB116	1Mb / 2P	High current density Chip Scale Package (CSP) LED
NXP Semiconductors	MF0FCP2U1	66Kb / 5P	Flip chip package Rev. 3.1-8 February 2007

О Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*Эта информация предназначена только для общих информационных целей, мы не несем ответственности за любые убытки или ущерб, вызванные вышеуказанной информацией.

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