CSOIC датащи(PDF) - Amkor Technology

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CSOIC датащи (PDF) - Amkor Technology

CSOIC Datasheet PDF - Amkor Technology


номер детали	CSOIC

скачать	CSOIC скачать

объем файла	374.01 Kbytes

Page	1 Pages

производитель	AMKOR [Amkor Technology]

домашняя страница	http://www.amkor.com

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подробное описание детали

Ceramic Small Outline Integrated Circuit Package

CSOIC Datasheet (PDF)

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скачать датащи

CSOIC Datasheet PDF - Amkor Technology


номер детали	CSOIC

скачать	CSOIC Click to download

объем файла	374.01 Kbytes

Page	1 Pages

производитель	AMKOR [Amkor Technology]

домашняя страница	http://www.amkor.com

Logo

подробное описание детали	Ceramic Small Outline Integrated Circuit Package

CSOIC датащи (HTML) - Amkor Technology

CSOIC Datasheet HTML 1Page - Amkor Technology

Аналогичный номер детали - CSOIC

производитель	номер детали	датащи	подробное описание детали
Schurter Inc.	CSO	256Kb / 2P	Heavy Duty Fuse Clip, 10.3 x 38 /10.3 x 85 mm, 1500 VAC/VDC, 32 A
	CSO	289Kb / 3P	Heavy Duty Fuse Clip, 10.3 x 38 /10.3 x 85 mm, 1500 VAC/VDC, 32 A
	CSO	329Kb / 3P	Heavy Duty Fuse Clip, 10.3 x 38 /10.3 x 85 mm, 1500 VAC/VDC, 32 A 12.08.2022
Crystek Corporation	CSO-016T	111Kb / 1P	5X7 mm SMD, 5V, HCMOS/TTL Clock Oscillator
Crystek Corporation	CSO-016T-25-49.152	111Kb / 1P	5X7 mm SMD, 5V, HCMOS/TTL Clock Oscillator

Аналогичное описание - CSOIC

производитель	номер детали	датащи	подробное описание детали
Amkor Technology	CSSOP	304Kb / 1P	Ceramic Shrink Small Outline Package
Advanced Power Electron...	AP1333GU-HF	98Kb / 4P	Small Package Outline
	AP2301EN-HF	102Kb / 4P	Small Package Outline
	AP2301N-HF	65Kb / 4P	Small Package Outline
	AP2306AGEN-HF	101Kb / 4P	Small Outline Package
	AP2318AGEN-HF	64Kb / 4P	Small Outline Package
	AP2323AGN-HF	104Kb / 4P	Small Package Outline
	AP2323GN-HF	101Kb / 4P	Small Package Outline
	AP2307GN-HF	65Kb / 5P	Small Package Outline
	AP2323AGN-HF	102Kb / 5P	Small Package Outline

О Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*Эта информация предназначена только для общих информационных целей, мы не несем ответственности за любые убытки или ущерб, вызванные вышеуказанной информацией.

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