■Features
●MCL-E-705G has low CTE values in X,Y directions and
　reduces warpage of package substrate significantly.
●MCL-E-705G Type（L） has lower CTE value（侑5ppm/℃).
●MCL-E-705G Type（LH） has lower CTE value（3ppm/℃).
●Well-suited for build-up construction.

■Applications
●Semiconductor packages.
　（FC-BGA,FC-CSP,PoP,SiP）
●HDI,PWB
●Thinner module,PWB