DESCRIPTION
The S172 surface mount Centigrid® relay is an ultraminiature, hermetically
sealed, armature relay for commercial applications. Its low profile height
(.370) and .100” grid spaced terminals make it an ideal choice where
extreme packaging density and/or close PC board spacing are required.
The specially formed J-leads are pre-tinned to make the relays ideal for all
types of surface-mount solder reflow processes.
The basic design and internal structure are similar to Teledyne’s DPDT
114 Centigrid® relay. Unique construction features and manufacturing
techniques provide overall high reliability and excellent resistance to
environmental extremes:

The S172 feature:
• All welded construction.
• High force/mass ratios for resistance to shock and vibration.
• Unique uni-frame design providing high magnetic efficiency and
mechanical rigidity.
• Advanced cleaning techniques provide maximum assurance of
internal cleanliness.
• Precious metal alloy contact material with gold plating assures excellent
high current and dry circuit switching capabilities.
The S172D relay has an internal discrete silicon diode for coil transient
suppression.