PRODUCT FEATURES
 Package dimensions 7.0x1.5x1.4 with 4 J-leads.
 Reliable resin mold SMD package suitable for SMT.
 Heat resistant mold allowing high temperature reflow.
 Suitable for low power consumption applications.
 RoHS compliant by exemption.
APPLICATIONS
 Real time clocks
 Microprocessors
 Timers and controllers
 Meters and handheld devices