Features
 Single 2.7 V - 3.6 V Supply
 Serial Peripheral Interface (SPI) and Quad Peripheral Interface (QPI) Compatible
 Supports SPI Modes 0 and 3
 Supports Dual Output Read and Quad I/O Program and Read
 Supports QPI Program and Read
 104 MHz Maximum Operating Frequency
 Clock-to-Output (tV1) of 6 ns
 Up to 52 MB/s continuous data transfer rate
 Quad SPI Enabled (factory default setting, see Section 6.7)
 Full Chip Erase
 Flexible, Optimized Erase Architecture for Code and Data Storage Applications
 0.6 ms Typical Page Program (256 Bytes) Time
 60 ms Typical 4-Kbyte Block Erase Time
 350 ms Typical 32-Kbyte Block Erase Time
 700 ms Typical 64-Kbyte Block Erase Time
 Hardware Controlled Locking of Protected Blocks via WP Pin
 4 kbit secured One-Time Programmable Security Register
 Software and Hardware Write Protection
 Serial Flash Discoverable Parameters (SFDP) Register
 Flexible Programming
 Byte/Page Program (1 to 256 Bytes)
 Dual or Quad Input Byte/Page Program (1 to 256 Bytes)
 Erase/Program Suspend and Resume
 JEDEC Standard Manufacturer and Device ID Read Methodology
 Low Power Dissipation
 2 µA Deep Power-Down Current (Typical)
 10 µA Standby current (Typical)
 Endurance: 100,000 program/erase cycles (4 kB, 32 kB or 64 kB blocks)
 Data Retention: 20 Years
 Industrial Temperature Range: -40°C to +85°C
 Industry Standard Green (Pb/Halide-free/RoHS Compliant) Package Options
 8-lead SOIC (208-mil)
 Die in Wafer Form