Features
• Plastic package has Underwriters Laboratory Flammability Classification 94V-0
• Ideal for automated placement
• Low profile package
• Built-in strain relief
• Exclusive patented PAR® oxide passivated chip construction
• 400W peak pulse power capability with a 10/1000ms waveform, repetition rate (duty cycle): 0.01%
• Excellent clamping capability
• Low incremental surge resistance
• Very fast response time
• For devices with V(BR) ≥ 10V ID are typically less than 1.0mA at TA = 150°C
• Designed for under the hood surface mount applications
• High temperature soldering: 250°C/10 seconds at terminals