General description
The LPC553x is an ARM Cortex-M33 based microcontroller for embedded applications.
These devices include up to 256 KB on-chip flash, up to 128 KB of on-chip SRAM,
FlexSPI with cache, USB Full-Speed device with crystal-less operation, USB Full-Speed
Host, CAN FD, five general-purpose timers, one SCTimer/PWM, one RTC/alarm timer,
one 24-bit Multi-Rate Timer (MRT), a Windowed Watchdog Timer (WWDT), Code
Watchdog Timer, one OS Timer, one Micro-tick timer, eight flexible serial communication
peripherals (Flexcomm Interfaces - which can be configured as a USART, SPI, high speed
SPI, I2C, or I2S interface), one DMIC, one I3C interface, four 16-bit 2.0 Msamples/sec
(four 12-bit 3.2 Msamples/sec) ADC capable of four simultaneous conversions, four
comparators, two temperature sensors, three 12-bit 1 Msample/sec DAC, 3 OpAmps, two
FlexPWM timers, and two QEIs.

Features and benefits
 ARM® Cortex-M33 core (r0p4):
 Running at a frequency of up to 150 MHz.
 Integrated digital signal processing (DSP) instructions.
 Floating Point Unit (FPU) and Memory Protection Unit (MPU).
 ARM Cortex M33 built-in Nested Vectored Interrupt Controller (NVIC).
 Non-maskable Interrupt (NMI) input with a selection of sources.
 Serial Wire Debug with eight breakpoints and four watch points. Includes Serial
Wire Output for enhanced debug capabilities and trace (ETM).
 System tick timer.
 A hardware DSP accelerator for fixed and floating point DSP functions (PowerQuad).
PowerQuad uses a bank of four dedicated 4 KB SRAMs
 On-chip memory:
 Up to 256 KB on-chip flash program memory, with flash accelerator and 512 byte
page erase and write, coupled with 8 KB Low Power Cache to enhance system
performance.
 Up to 128 KB total SRAM consisting of 16 KB SRAM on Code Bus, 112 KB SRAM
on System Bus (112 KB is contiguous).
 Parity support on all RAM banks except RAM1 bank. ECC support available only
on RAM1 bank.
 OTP eFuse programmable memory.
 On-chip ROM bootloader supports:
 Booting of images from on-chip flash and external flash.
 CRC32 image integrity checking.
 Flash programming through In System Programming (ISP) commands over
following interfaces: USB0 interfaces using HID Class device, UART interface
(Flexcomm 0) with auto baud, High-Speed SPI slave interfaces (Flexcomm 8)
using mode 3 (CPOL = 1 and CPHA = 1), I2C slave interface (Flexcomm 1), and
CAN-FD ISP.
 ROM API functions:
Flash programming API and OTP eFuse programming API.
 Dual images (boot latest version) from on-chip flash using re-map feature.
 Loading image to RAM from external Octal/QuadSPI device.
 Booting Execute-in-Place (XIP) images present on Octal/QuadSPI devices.
 Dual Execute-in-Place (XIP) images in Octal/QuadSPI flash through flash address
remap feature.
 Load-to-RAM boot mode from 1-bit SPI flash devices connected to Flexcomm
(selectable by PFR) as normal boot option and recovery boot option.
 USB Device DFU Connection (Device only).
 Code Read protection (CRP) on non-secure devices.
 Crystal-less USB ISP Device mode.
 Serial interfaces:
 Flexcomm Interface contains up to eight serial peripherals (Flexcomm Interface
0-7). Each Flexcomm Interface can be selected by software to be a USART, SPI,
I2C, and I2S interface. Each Flexcomm Interface includes a FIFO that supports
USART, SPI, and I2S. A variety of clocking options are available to each Flexcomm
Interface, including a shared fractional baud-rate generator, and time-out
feature.Flexcomm interfaces 0 to 5 each provide one channel pair of I2S and
Flexcomm interfaces 6 to 7 each provide four channel pairs of I2S.
 I2C-bus interfaces support Fast-mode and Fast-mode Plus with data rates of up to
1Mbit/s and with multiple address recognition and monitor mode. Two sets of true
I2C pads also support high-speed Mode (3.4 Mbit/s) as a slave.
 High Speed SPI (Flexcomm 8, 50MHz for both master and slave).
 A digital microphone interface supporting up to two channels with associated
decimators and Voice Activation Detect. One pair of channels can be streamed
directly to I2S. The DMIC supports DMA.
 One I3C bus interface.
 One CAN FD module with dedicated DMA controller.
 USB 2.0 full speed host/device controller with on-chip PHY and dedicated DMA
controller supporting crystal-less operation in device mode using software library
example in Application Note (AN13527, LPC55S3x/LPC553x Crystal-Less USB
Solution).
 Digital peripherals:
 DMA0 controller with 52 channels and up to 53 programmable triggers, able to
access all memories and DMA-capable peripherals.
 DMA1 controller with 16 channels and up to 25 programmable triggers, able to
access all memories and DMA-capable peripherals.
 CRC engine block can calculate a CRC on supplied data using one of three
standard polynomials with DMA support. Supports programmable CRC polynomial.
 Up to 66 General-Purpose Input/Output (GPIO) pins.
 GPIO registers are located on the AHB for fast access. The DMA supports GPIO
ports.
 Up to eight GPIOs can be selected as pin interrupts (PINT), triggered by rising,
falling or both input edges.
 A group of up to 8 GPIO pins can be selected for boolean pattern matching, which
can generate interrupts and/or drive a pattern-match output.
 Two GPIO grouped interrupts (GINT) enable an interrupt based on a logical
(AND/OR) combination of input states.
 I/O pin configuration with support for up to 16 signal options.
 FlexSPI flash interface for external flash with 8 KB cache for execute-in-place and
supports DMA. The FlexSPI includes 1 port: high speed
channel A which supports quad or octal operation. Support dual image via address
remapping.
 Two AOI (AND/OR/Invert) combinatorial logic modules with dedicated set of input
and output signals. Each AOI has 4 outputs that feed to different peripheral muxes
to individual peripherals.
 128 bit unique device serial number for identification (UUID).
 Timers:
 Five 32-bit standard general purpose asynchronous timers/counters, which support
up to four capture inputs and four compare outputs, PWM mode, and external
count input. Specific timer events can be selected to generate DMA requests.
 One SCTimer/PWM with 8 input and 10 output functions (16 capture and match
registers). Inputs and outputs can be routed to or from external pins and internally
to or from selected peripherals. Internally, the SCTimer/PWM supports 16
captures/matches, 16 events, 32 states, and a Dither engine for improved average
resolution of pulse edges.
 32-bit Real-time clock (RTC) with calendar feature and 1 s resolution running in the
always-on power domain. Another timer in the RTC can be used for wake-up from
all low power modes including deep power-down, with 1 ms resolution. The RTC is
clocked by the 32 kHz FRO or 32.768 kHz external crystal.
 Multiple-channel multi-rate 24-bit timer (MRT) for repetitive interrupt generation at
up to four programmable, fixed rates.
 Windowed Watchdog Timer (WWDT) with FRO 1 MHz as clock source.
 The Micro-Tick Timer running from the watchdog oscillator can be used to wake-up
the device from sleep and deep-sleep modes. Includes 4 capture registers with pin
inputs.
 42-bit free running OS Timer as continuous time-base for the system, available in
any reduced power modes. It has a selectable clock source. When a 32 kHz clock
is selected, allows a count period of more than 4 years.
 Motor Control Subsystem: 2x FlexPWM with 4 sub-modules, providing 24 PWM
outputs (it supports two 3-phase motors), and 2 Quadrature Encoder/Decoder (QEI).
 Analog peripherals:
 Four single-ended 16-bit or two differential input ADCs (selectable) with sample
rate of 2.0 Msamples/sec in 16-bit mode and 3.2 Msamples/sec in 12-bit mode.
Eight differential channel pairs, (or 16 single-ended channels), with multiple internal
and external trigger inputs. The ADC supports four simultaneous conversions,
under the control of two independent sequences.
 Integrated temperature sensor connected to both ADCs.
 One comparator in always-on domain with up to four input pins and internal
reference voltage. Can be used as a wake-up source from low power modes.
 Three High Speed Comparators with up to five input pins and internal reference
voltage.
 Three 12-bit DACs with sample rates of up to 1.0 MSample/sec.
 Three OpAmps with programmable VREF.
 Clock generation:
 Internal Free Running Oscillator (FRO). This oscillator provides a selectable 96
MHz output, and a 12 MHz output (divided down from the selected higher
frequency) that can be used as a system clock. The FRO is trimmed to +/- 1%
accuracy over the entire voltage and 0 C to 85 C. The FRO is trimmed to +/- 2%
accuracy over the entire voltage and -40 C to 105 C.
 32 kHz Internal Free Running Oscillator FRO. The FRO is trimmed to +/- 2%
accuracy over the entire voltage and temperature range.
 Internal low power oscillator (FRO 1 MHz) trimmed to +/- 15% accuracy over the
entire voltage and temperature range.
 Crystal oscillator with an operating frequency of 12 MHz to 32 MHz. Option for
external clock input (bypass mode) for clock frequencies of up to 25 MHz.
 Crystal oscillator with 32.768 kHz operating frequency.
 PLL0 and PLL1 allows CPU operation up to the maximum CPU rate without the
need for a high-frequency external clock. PLL0 and PLL1 can run from the internal
FRO 12 MHz output, the external oscillator, internal FRO 1 MHz output, or the
32.768 kHz RTC oscillator.
 Clock output function with divider to monitor internal clocks.
 Frequency measurement unit for measuring the frequency of any on-chip or
off-chip clock signal.
 Each crystal oscillator has one embedded capacitor bank, where each can be used
as an integrated load capacitor for the crystal oscillators. Using APIs, the capacitor
banks on each crystal pin can tune the frequency for crystals with a Capacitive
Load (CL) leading to conserving board space and reducing costs.
 Power-saving modes and wake-up:
 Integrated PMU (Power Management Unit) to minimize power consumption.
 Low power modes: Sleep, Deep-sleep with RAM retention, power-down with RAM
retention and CPU retention, and deep power-down with RAM retention.
 Configurable wake-up options from peripherals interrupts.
 The Micro-Tick Timer running from the watchdog oscillator can be used to wake-up
the device from sleep and deep-sleep modes.
 The Real-Time Clock (RTC) running from the 32.768 kHz clock can be used to
wake-up the device from sleep, deep-sleep, power-down, and deep power-down modes.
 Power-On Reset (POR) (trip low-level of 0.705 V and trip high-level of 0.87 V).
 Brown-Out Detectors (BOD) for external VDD_MAIN and internal VDD_CORE with
separate thresholds for forced reset.
 Operating from internal DC-DC converter or selectable LDO such that DC-DC
converter can be bypassed.
 On-chip LDO core 1.8 V to 3.6 V.
 DC-DC power supply 1.8 V to 3.6 V.
 Two Main IO supplies (VDDIO_1: 1.8 V to 3.6 V, VDDIO_2: 1.08 v to 3.6 V).
 Separate VBAT supply 1.71 V to 3.6 V.
 JTAG boundary scan supported.
 Operating temperature range 40 °C to +105 °C.
 Available in HLQFP100, HTQFP64, and HVQFN48 packages.