FEATURES
• Flat chip contacted top and bottom
(NTCC201E4 series)
• Green thermistor - does not use RoHS
exemptions
• Wide temperature range from -55 °C to +175 °C
(resistant to repetitive short periods at 200 °C,
as for example, 10 times 10 s)
• Highly resistant to mounting conditions
• Ideal for aluminum wire
• Resistance to leaching during reflow soldering
process
• Delivered on blister tape
• AEC-Q200 qualified
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912

APPLICATIONS
• High temperature sensing, control and compensation in
power semiconductor modules (e.g. IGBT, MOSFET,
Diodes, …), inverters in EV/HEV vehicles, and windmills
• IC and semiconductor protecting
• DC/AC power inverters and HIC overheat protecting

DESIGN-IN SUPPORT
For complete curve computation, please visit:
www.vishay.com/thermistors/ntc-curve-list/

MARKING
The thermistors have no marking and have electrode
termination design without orientation.
Wire bonding:
• The silver electrode has been tested for aluminum wire
bonding with a wire diameter of max. 300 μm
Encapsulation:
• In order to preserve the characteristics of the bonded die
at long term an encapsulation is mandatory
• The encapsulation is defined by the user. Silicon and
epoxy encapsulations have been tested. For
recommendations on compatible encapsulants contact
Vishay