Features
• 3-level topology
• ACEPACK 2 power module
– 13 mΩ of typical RDS(on) each switch
– Insulation voltage UL certified of 2.5 kVrms
– Integrated NTC temperature sensor
– DBC Cu-Al2O3-Cu based
– Press fit contact pins

Description
This ACEPACK 2 power module represents a leg of a T-type 3-level inverter
topology that integrates the advanced silicon carbide Power MOSFET technology
from STMicroelectronics. This module leverages the innovative properties of the
wide-bandgap SiC material and a high-thermal-performance substrate. The result is
exceptionally low on-resistance per unit area and excellent switching performance
that is virtually independent of temperature. An NTC sensor completes the design.

Applications
• DC/DC converter