FEATURES
• 3 V to 16 V single supply or ± 3 V to ± 8 V dual
supply
• Low charge injection (1.4 pC typ.)
• Leakage current < 0.25 nA at 85 °C
• Low switch capacitance (Csoff 3 pF typ.)
• Fully specified with single supply operation at
3 V, 5 V, and dual supplies at ± 5 V
• Low voltage, 2.5 V CMOS/TTL compatible
• 1 GHz, 3 dB bandwidth
• Excellent isolation performance (-59 dB at 10 MHz)
• Excellent crosstalk performance (-74 dB at 10 MHz)
• Fully specified from -40 °C to +85 °C and -40 °C to +125 °C
• 16 lead SOIC, TSSOP and miniQFN package
(1.8 mm x 2.6 mm)
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912

APPLICATIONS
• Precision instrumentation
• Medical instrumentation
• Automated test equipment
• High speed communications applications
• High-end data acquisition
• Sample and hold applications
• Sample and hold systems

DESCRIPTION
The DG611E, DG612E, and DG613E contain four
independently selectable SPST switches. They offer
improved performance over the industry standard DG611
and DG611A series. The DG611E and DG612E have all
switches normally closed and normally open respectively,
while the DG613E has 2 normally open and 2 normally
closed switches.
They are designed to operate from a 3 V to 16 V single
supply or from ± 3 V to ± 8 V dual supplies and are fully
specified at +3 V, +5 V and ± 5 V. All control logic inputs
have guaranteed 2 V logic high limits when operating from
+5 V or ± 5 V supplies and 1.4 V when operating from a
+3 V supply.
The DG611E, DG612E, and DG613E switches conduct
equally well in both directions and offer rail to rail analog
signal handling.
1.4 pC low charge injection, coupled with very low switch
capacitance: 3 pF, fast switching speed: ton/toff 23 ns/14 ns
and excellent 3 dB bandwidth: 1 GHz, make these products
ideal for precision instrumentation, high-end data
acquisition, automated test equipment and high speed
communication applications.
Operation temperature is specified from -40 °C to +125 °C.
The DG611E, DG612E, and DG613E are available in 16 lead
SOIC, TSSOP and the space saving 1.8 mm x 2.6 mm
miniQFN packages.