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IXTK102N30P Datasheet with Chat AI
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  • Part No.IXTK102N30P
    ManufacturerISC
    Size194 Kbytes
    Pages2 pages
    DescriptionIsc N-Channel MOSFET Transistor
    Datasheet Summary with AI

    # Isc N-Channel MOSFET Transistor IXTK102N30P

    ## Features

    · To-3PL package
    · Low input capacitance & gate charge
    · Low gate input resistance
    · 100% avalanche tested
    · Robust device performance & reliable operation

    ## Absolute Maximum Ratings (Ta=25℃)

    SYMBOL PARAMETER VALUE UNIT
    VDSS Drain-Source Voltage 300 V
    VGSS Gate-Source Voltage ±30 V
    ID Drain Current - Continuous 102 A
    IDM Drain Current - Single Pulsed 250 A
    PD Total Dissipation @TC=25℃ 700 W
    Tch Max. Operating Junction Temperature 150
    Tstg Storage Temperature -55~150

    ## Thermal Characteristics

    SYMBOL PARAMETER MAX UNIT
    Rth(ch-c) Channel-to-case thermal resistance 0.18 ℃/W
    Rth(ch-a) Channel-to-ambient thermal resistance 62 ℃/W

    ## Electrical Characteristics (TC=25℃)

    SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT
    BVDSS Drain-Source Breakdown Voltage VGS=0V; ID=0.25mA 300 V
    VGS(th) Gate Threshold Voltage VDS=VGS; ID=0.5mA 2.5 5.0 V
    RDS(on) Drain-Source On-Resistance VGS=10V; ID=51A 33
    IGSS Gate-Source Leakage Current VGS=±20V; VDS=0V ±0.2 μA
    IDSS Drain-Source Leakage Current VDS=300V; VGS=0V; Tj=25℃<br>VDS=300V; VGS=0V; Tj=150℃ 25<br>250 μA
    VSDF Diode forward voltage ISD=102A, VGS = 0 V 1.5 V

    isc website: www.iscsemi.cn

    # Isc N-Channel MOSFET Transistor IXTK102N30P

    ## Features

    · To-3PL package
    · Low input capacitance & gate charge
    · Low gate input resistance
    · 100% avalanche tested
    · Robust device performance & reliable operation

    ## Absolute Maximum Ratings (Ta=25℃)

    SYMBOL PARAMETER VALUE UNIT
    VDSS Drain-Source Voltage 300 V
    VGSS Gate-Source Voltage ±30 V
    ID Drain Current - Continuous 102 A
    IDM Drain Current - Single Pulsed 250 A
    PD Total Dissipation @TC=25℃ 700 W
    Tch Max. Operating Junction Temperature 150
    Tstg Storage Temperature -55~150

    ## Thermal Characteristics

    SYMBOL PARAMETER MAX UNIT
    Rth(ch-c) Channel-to-case thermal resistance 0.18 ℃/W
    Rth(ch-a) Channel-to-ambient thermal resistance 62 ℃/W

    ## Electrical Characteristics (TC=25℃)

    SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT
    BVDSS Drain-Source Breakdown Voltage VGS=0V; ID=0.25mA 300 V
    VGS(th) Gate Threshold Voltage VDS=VGS; ID=0.5mA 2.5 5.0 V
    RDS(on) Drain-Source On-Resistance VGS=10V; ID=51A 33
    IGSS Gate-Source Leakage Current VGS=±20V; VDS=0V ±0.2 μA
    IDSS Drain-Source Leakage Current VDS=300V; VGS=0V; Tj=25℃<br>VDS=300V; VGS=0V; Tj=150℃ 25<br>250 μA
    VSDF Diode forward voltage ISD=102A, VGS = 0 V 1.5 V

    isc website: www.iscsemi.cn

    Part No.IXTK102N30P
    ManufacturerISC
    Size194 Kbytes
    Pages2 pages
    DescriptionIsc N-Channel MOSFET Transistor
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