## Electronic Specifications of XFHCL4-R80M The **XFHCL4-R80M** is a high-performance, surface-mount (SMD) power inductor commonly used in DC-DC converters and power management modules. Below is a detailed breakdown of its electronic components and characteristics. --- ### 1. General Specifications This part is typically categorized as a **Molded Power Inductor**. The part number nomenclature usually breaks down as follows: * **XF:** Manufacturer prefix (commonly XFMRS). * **HCL4:** Series identifier (High Current, Low Profile). * **R80:** Inductance value ($0.80 \mu H$). * **M:** Tolerance ($\pm 20\%$). ### 2. Technical Parameters | Parameter | Value / Description | | :--- | :--- | | **Inductance** | $0.80 \mu H$ | | **Tolerance** | $\pm 20\%$ | | **DC Resistance (DCR)** | Typ: $1.8 m\Omega$ / Max: $2.2 m\Omega$ | | **Saturation Current ($I_{sat}$)** | ~ $30A$ - $35A$ (typical drop of 30%) | | **Heating Current ($I_{rms}$)** | ~ $20A$ - $25A$ (typical rise of 40°C) | | **Operating Temperature** | $-40^{\circ}C$ to $+125^{\circ}C$ | --- ### 3. Key Electronic Features * **Composite Molded Construction:** The core is made of a metal alloy powder pressed around the copper coil. This design reduces "buzz" noise and provides excellent magnetic shielding to prevent Electromagnetic Interference (EMI). * **High Saturation:** Unlike traditional ferrite inductors, these molded types have a "soft" saturation curve. This means the inductance drops gradually as current increases, rather than crashing abruptly. * **Low DCR:** The use of thick flat or round wire minimizes DC resistance, which reduces power loss and heat generation during high-current operation. ### 4. Typical Applications The XFHCL4-R80M is designed for high-density power electronics, including: 1. **Voltage Regulator Modules (VRM):** For CPUs and GPUs. 2. **Point of Load (POL) Converters:** In telecommunications and servers. 3. **Battery Powered Devices:** Where high efficiency is required to extend battery life. 4. **DC-DC Converters:** Buck, Boost, and Buck-Boost topologies. --- ### 5. Footprint/Physical Layout The "4" in the series often refers to a specific physical size (e.g., $4.0 \times 4.0 mm$ or similar footprint). ```markdown [ Top View ] [ Side View ] ___________ ___________ | | | | | R80 | |___________| <-- Molded Body | | _|_ _|_ |___________| [___] [___] <-- Solder Terminals ```