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  • TO263

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    ## Understanding the TO-263 Package The **TO-263** (Transistor Outline 263), also commonly known as **D2PAK** (Double Decawatt Package), is a popular surface-mount technology (SMT) package used for high-power semiconductor devices. It is the surface-mount evolution of the classic through-hole TO-220 package. --- ### 1. Key Characteristics The TO-263 is designed to handle significant power levels while maintaining a relatively small footprint. | Feature | Description | | :--- | :--- | | **Mounting Type** | Surface Mount (SMD / SMT) | | **Heat Dissipation** | High; includes a large metal tab for soldering to the PCB copper | | **Pin Count** | Usually 3, 5, or 7 pins | | **Current Capacity** | Can handle high current (often up to 100A+ depending on the silicon) | | **Size** | Approximately 10mm x 15mm (including tab and leads) | --- ### 2. Common Components in TO-263 Because of its thermal efficiency, this package is typically used for components that generate heat: * **MOSFETs:** Used in switching power supplies and motor controllers. * **Voltage Regulators:** Both linear (like the LM2596) and LDOs. * **Diodes:** High-current Schottky or Power Rectifiers. * **IGBTs:** Used in high-power industrial applications. --- ### 3. Thermal Management One of the most critical aspects of the TO-263 is the **Exposed Pad (Tab)**. * The tab is usually connected to the middle pin (electrically). * It is soldered directly to a large copper area on the PCB. * This copper area acts as a **Heat Sink**, drawing thermal energy away from the silicon die to prevent overheating. --- ### 4. Variants of the TO-263 The package comes in different versions based on the number of leads required for more complex Integrated Circuits (ICs). ```text TO-263-3 (3 Pins): Standard for MOSFETs and simple Regulators. TO-263-5 (5 Pins): Common for adjustable switching regulators. TO-263-7 (7 Pins): Used for high-integration power ICs. ``` --- ### 5. TO-220 vs. TO-263 While they share similar internal silicon capabilities, their application differs: | Feature | TO-220 | TO-263 (D2PAK) | | :--- | :--- | :--- | | **Mounting** | Through-hole | Surface Mount | | **Heat Sink** | External metal sink bolted on | PCB Copper / Surface heat sink | | **Assembly** | Manual or Wave Soldering | Reflow Soldering (Automated) | | **Space** | Vertical (Taller) | Horizontal (Flatter) |
    ✨ Follow-up Questions
    • What is the difference between TO-263 and TO-252 (DPAK)?
    • How do I calculate the required copper area for cooling a TO-263 package?
    • Can a TO-263 component be manually soldered with a standard soldering iron?