The **M2AS1-6333-R2** is a specialized high-speed backplane connector, typically used in telecommunications, data centers, and high-performance computing environments. It belongs to the **AirMax VS (Virtual Shielding)** series originally developed by FCI (now part of Amphenol Communications Solutions). --- ### 1. Technical Specifications The "R2" suffix generally denotes a specific revision or RoHS compliance status. Below are the core electronic and mechanical characteristics: | Property | Description | | :--- | :--- | | **Connector Type** | Right-Angle Header (Signal) | | **Series** | AirMax VS / VS2 | | **Number of Positions** | 120 Positions (Typical for this configuration) | | **Pitch** | 2.00 mm or 3.00 mm (depending on column spacing) | | **Data Rate** | Supports 12.5 Gbps to 25 Gbps per pair | | **Termination** | Press-fit (Eye-of-the-needle) | | **Impedance** | 100 Ohms (Differential) | --- ### 2. Key Electronic Features #### A. Virtual Shielding Technology Unlike traditional connectors that use physical metallic shields between every signal pair (adding weight and cost), the M2AS1 series uses **Virtual Shielding**. * **Mechanism:** The geometry and arrangement of the pins create an electromagnetic barrier. * **Benefit:** Reduces crosstalk (NEXT/FEXT) without the need for extra grounding hardware. #### B. Signal Integrity (SI) The part is designed for high-density differential signaling. * **Low Insertion Loss:** Optimized for long traces on backplanes. * **Skew Control:** The lead frames are designed to minimize the time delay difference between the two wires in a differential pair. #### C. Press-Fit Attachment The "R2" version utilizes **Press-fit technology** for PCB mounting: * **Solderless:** Eliminates thermal stress on the board during assembly. * **Reliability:** Provides a gas-tight connection that is highly resistant to vibration and mechanical shock. --- ### 3. Material Composition * **Housing:** High-temperature thermoplastic (UL 94 V-0 rated), designed to withstand industrial environments. * **Contacts:** Copper alloy with high-performance plating (usually Gold or GXT over Nickel) to ensure conductivity and prevent corrosion over thousands of mating cycles. --- ### 4. Typical Applications This part is commonly found in: 1. **Blade Servers:** Connecting the CPU blades to the midplane. 2. **Network Switches:** High-speed data routing hardware. 3. **Storage Arrays:** Facilitating high-bandwidth data transfer between drive controllers and the backplane.