The **M2AS1-4434-R2** is a specific technical assembly, typically associated with specialized electronic cooling systems or heat sink modules used in high-performance computing (such as server environments or GPU cooling). Below is a breakdown of its electronic and mechanical characteristics. --- ### 1. Component Overview The part number generally refers to an **Active Heat Sink Assembly**. It combines passive thermal management (fins) with active electronic components (fan/motor). | Category | Description | | :--- | :--- | | **Part Type** | Active Cooling Module / Heat Sink | | **Primary Material** | Aluminum (Fins) and Copper (Base/Heat pipes) | | **Interface** | PWM (Pulse Width Modulation) Fan Connector | | **Application** | Server CPUs, Embedded Computing, or GPU Cooling | --- ### 2. Key Electronic Sub-components This assembly is comprised of several critical electronic and electromechanical parts: #### A. The Brushless DC (BLDC) Fan The heart of the "active" cooling is the fan motor. * **Voltage:** Typically rated for 12V DC. * **Bearing Type:** Usually Dual Ball Bearing for high-reliability/long-life server applications. * **Control Logic:** Features an internal IC for commutation and speed regulation. #### B. The Wiring Harness (Pinout) The module connects to a motherboard or controller via a standard header (often 4-pin): 1. **GND (Black):** Ground. 2. **VCC (Red/Yellow):** Power supply (12V). 3. **Tachometer (Green/Blue):** Sends a pulse signal to the system to report RPM. 4. **PWM (Blue/Yellow):** Receives a signal to adjust fan speed based on temperature. #### C. Thermal Interface Material (TIM) While not "electronic" in the sense of circuitry, the TIM (pre-applied paste or pad) is electrically non-conductive but thermally conductive, ensuring the heat transfer from the silicon die to the metal assembly. --- ### 3. Technical Specifications While specific revisions (like R2) can vary by manufacturer (often associated with brands like *Dynatron* or *Cooler Master* in OEM contexts), typical specs for this class of device include: | Feature | Typical Specification | | :--- | :--- | | **Max Airflow** | 25 - 45 CFM | | **Noise Level** | 30 - 55 dBA (depending on RPM) | | **Rated Current** | 0.2A - 0.6A | | **Dimensions** | Roughly 80mm to 100mm footprint | --- ### 4. Common Use Cases * **1U/2U Servers:** Designed to fit in low-profile rackmount enclosures. * **Workstations:** Used for processors with high TDP (Thermal Design Power) that require targeted airflow. * **Industrial PCs:** Used where high-vibration resistance and longevity are required.