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  • ATS-P2-34-C3-R0

  • AI
    The **ATS-P2-34-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW™" product line, designed to dissipate heat from integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 36.83mm x 36.83mm x 22.86mm | | **Attachment Method** | pushPIN™ (Brass pins with Steel springs) | | **Thermal Resistance** | 6.81 °C/W (@ 1.0 m/s airflow) | | **Fin Style** | maxiFLOW (Tapered Fin Design) | | **Thermal Interface Material** | T412 (Pre-applied) | --- ### 2. Key Electronic Features #### A. Thermal Management (Heat Dissipation) The primary "electronic" function of this part is to prevent thermal throttling or hardware failure in semiconductor devices. The **maxiFLOW™** design uses a unique fin geometry that increases surface area and creates turbulence, which allows for maximum heat transfer in low-airflow environments. #### B. pushPIN™ Attachment System This component uses a mechanical mounting system rather than adhesive. This is critical for electronics because: * **Reliability:** It ensures constant pressure on the semiconductor die for optimal thermal contact. * **Maintenance:** It allows for the heat sink to be removed and reattached without damaging the PCB (Printed Circuit Board). #### C. Thermal Interface Material (TIM) The part comes with **T412** pre-applied. This is a high-performance phase-change material that fills microscopic air gaps between the electronic component (heat source) and the aluminum sink to reduce thermal resistance. --- ### 3. Usage Context In a circuit design, this part is typically used on high-density PCBs where space is limited but heat generation is high. It is commonly found in: * Networking hardware (Routers, Switches). * Embedded computing systems. * Power supplies and industrial controllers. ---
    ✨ Follow-up Questions
    • ⤷What is the difference between pushPIN and adhesive mounting in electronics?
    • ⤷ How does the T412 thermal interface material compare to standard thermal grease?
    • ⤷ Can this heat sink be used on a standard Raspberry Pi or similar SoC?