ATS-P2-34-C3-R0
AI

The **ATS-P2-34-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW™" product line, designed to dissipate heat from integrated circuits (ICs) like CPUs, GPUs, or FPGAs.
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of this component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized) |
| **Dimensions** | 36.83mm x 36.83mm x 22.86mm |
| **Attachment Method** | pushPIN™ (Brass pins with Steel springs) |
| **Thermal Resistance** | 6.81 °C/W (@ 1.0 m/s airflow) |
| **Fin Style** | maxiFLOW (Tapered Fin Design) |
| **Thermal Interface Material** | T412 (Pre-applied) |
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### 2. Key Electronic Features
#### A. Thermal Management (Heat Dissipation)
The primary "electronic" function of this part is to prevent thermal throttling or hardware failure in semiconductor devices. The **maxiFLOW™** design uses a unique fin geometry that increases surface area and creates turbulence, which allows for maximum heat transfer in low-airflow environments.
#### B. pushPIN™ Attachment System
This component uses a mechanical mounting system rather than adhesive. This is critical for electronics because:
* **Reliability:** It ensures constant pressure on the semiconductor die for optimal thermal contact.
* **Maintenance:** It allows for the heat sink to be removed and reattached without damaging the PCB (Printed Circuit Board).
#### C. Thermal Interface Material (TIM)
The part comes with **T412** pre-applied. This is a high-performance phase-change material that fills microscopic air gaps between the electronic component (heat source) and the aluminum sink to reduce thermal resistance.
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### 3. Usage Context
In a circuit design, this part is typically used on high-density PCBs where space is limited but heat generation is high. It is commonly found in:
* Networking hardware (Routers, Switches).
* Embedded computing systems.
* Power supplies and industrial controllers.
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- ⤷What is the difference between pushPIN and adhesive mounting in electronics?
- ⤷ How does the T412 thermal interface material compare to standard thermal grease?
- ⤷ Can this heat sink be used on a standard Raspberry Pi or similar SoC?