## Technical Overview: ATS-P2-34-C2-R0 The **ATS-P2-34-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed specifically for thermal management of electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Product Series** | pushPIN™ | | **Heat Sink Type** | Straight Fin | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Overall Dimensions** | 35mm x 35mm x 25mm | | **Thermal Resistance** | 14.33 °C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Component Breakdown #### A. The Heat Sink Body The body is constructed from high-grade aluminum. It uses a **straight fin** geometry, which is ideal for systems with a clear airflow path. The blue anodized finish is not just for aesthetics; it provides surface protection and slightly increases emissivity for better radiation cooling. #### B. The pushPIN™ Attachment System Instead of using messy adhesives or permanent solder, this part uses a mechanical push-pin mechanism. * **Springs:** High-tension springs provide consistent pressure (loading) on the electronic component to ensure maximum heat transfer. * **Compression:** This ensures the Thermal Interface Material (TIM) is spread evenly across the die. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates the specific thermal performance grade. This model comes with **T766** pre-applied. This is a "phase-change" style material that fills the microscopic air gaps between the chip and the heat sink. --- ### 3. Airflow Performance (Thermal Resistance) Thermal performance is measured in °C/W (degrees Celsius per Watt). A lower number indicates better cooling. | Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | | :--- | :--- | :--- | :--- | :--- | :--- | | **Unducted Flow** | 14.33 | 5.22 | 2.91 | 2.05 | 1.64 | | **Ducted Flow** | 2.73 | 1.70 | 1.36 | 1.17 | 1.05 | --- ### 4. Dimensional Diagram Reference To integrate this into a PCB design, engineers must account for the following: * **Height (A):** 35.00 mm * **Width (B):** 35.00 mm * **Depth (C):** 25.00 mm * **Pitch (E):** 40.00 mm (Spacing between attachment holes)