The **ATS-P2-33-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for cooling electronic components such as CPUs, GPUs, and other high-heat-density semiconductors. ### 1. Technical Specifications The following table highlights the core physical and thermal properties of the unit: | Parameter | Specification | | :--- | :--- | | **Product Series** | pushPIN™ Heat Sink | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions (L x W x H)** | 54.00mm x 38.00mm x 17.78mm | | **Thermal Resistance** | 1.80°C/W (at 200 LFM) | | **Thermal Interface Material** | T412 (Non-silicon based) | --- ### 2. Design Features The "C3" designation in the part number indicates specific design choices meant for efficiency: * **Fin Pitch:** It features a fine-pitch design to maximize surface area for heat dissipation without significantly blocking airflow. * **Thermal Interface Material (TIM):** It comes pre-applied with **T412**, which ensures optimal heat transfer from the component to the aluminum base without the mess of manual thermal paste application. * **Push-Pin Attachment:** The use of a push-pin mechanism provides a secure, consistent downward force (pressure), which is critical for maintaining thermal contact under vibration or thermal cycling. --- ### 3. Electronic Application This part is typically used in the following electronic environments: 1. **Telecommunications:** Cooling line cards and high-speed networking chips. 2. **Power Electronics:** Dissipating heat from MOSFETs or IGBT modules. 3. **Embedded Systems:** For industrial PCs where space is limited but thermal loads are high. ### 4. Part Number Breakdown Understanding the nomenclature: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **P2:** pushPIN™ Series. * **33:** Specific body size/fin configuration. * **C3:** Material/Finish/Performance category. * **R0:** Revision code (Standard). ---