The **ATS-P2-208-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** product line, designed to provide high thermal performance in environments with restricted airflow. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 70mm x 70mm x 10mm | | **Thermal Resistance** | 6.69°C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Design Features * **maxiFLOW™ Geometry:** The heat sink features a tapered fin design that maximizes the surface area for heat dissipation. This design reduces pressure drop across the device, making it highly efficient in forced-convection environments. * **pushPIN™ Attachment:** Instead of messy adhesives, this part uses a mechanical push-pin system. This ensures consistent pressure between the heat sink and the electronic component (CPU, FPGA, or GPU), optimizing heat transfer. * **Pre-Applied TIM:** It comes with **T766 thermal interface material** already applied to the base. This simplifies the assembly process and ensures no air gaps exist between the heat sink and the chip. * **Low Profile:** With a height of only **10mm**, it is ideal for 1U servers or slim electronic enclosures where vertical space is limited. --- ### 3. Applications The ATS-P2-208-C2-R0 is typically used for cooling mid-to-high power electronic components, including: * **Telecommunications:** Cooling of high-speed network switches and routers. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Electronics:** Dissipating heat from large MOSFET arrays or power converters. ---