The **ATS-P2-200-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and other high-heat-generating integrated circuits. --- ## 1. Technical Specifications The following table summarizes the physical and material characteristics of this specific component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 9.78°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 54mm x 54mm x 10mm | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Fin Pattern** | Straight Fin (Extruded) | --- ## 2. Component Composition The ATS-P2-200-C2-R0 consists of three primary elements that work together to manage thermal dissipation: ### A. The Heat Sink Body * **Material:** Made from high-grade aluminum, which offers a high thermal conductivity-to-weight ratio. * **Design:** Features a low-profile (10mm height) design, making it ideal for compact electronic enclosures or 1U/2U server chassis. ### B. Thermal Interface Material (TIM) * **T766 Phase Change Material:** This unit usually comes pre-applied with a thermal pad or phase-change material on the base. This fills the microscopic air gaps between the heat sink and the electronic chip to improve heat transfer efficiency. ### C. Attachment Mechanism (Push Pins) * **Mechanical Connection:** Unlike adhesive-based heat sinks, this uses a spring-loaded push-pin system. * **Benefit:** Provides consistent downward pressure on the chip, ensuring better thermal contact and allowing for thermal expansion/contraction without losing mechanical integrity. --- ## 3. Thermal Performance Analysis The efficiency of this part is highly dependent on airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 9.78 | | 300 | 6.91 | | 400 | 5.48 | | 500 | 4.63 | --- ## 4. Typical Applications This part is commonly used to cool: * **FPGA & ASIC:** High-density programmable logic devices. * **Networking Equipment:** Routers and switches with high-speed processors. * **Embedded Systems:** Industrial PCs and automation controllers.