The **ATS-P2-173-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, FPGAs, and power modules. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 4.72°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 30.00mm | --- ### 2. Physical Design and Construction * **Finned Profile:** This part features a **straight-fin** design. The fins increase the surface area available for heat transfer between the electronic component and the surrounding air. * **Dimensions:** Its square footprint (30mm x 30mm) makes it ideal for medium-sized integrated circuits (ICs). * **Material:** Made from aluminum for a balance of lightweight construction and high thermal conductivity. The "Blue Anodized" finish protects against corrosion and increases thermal emissivity. ### 3. Electronic Attachment System (pushPIN™) One of the most critical "electronic parts" of this assembly is the mounting mechanism: * **Push-Pin:** This eliminates the need for messy adhesives or complex bolting. It uses a spring-loaded pin that snaps into pre-drilled holes on the Printed Circuit Board (PCB). * **Compression Spring:** The "R0" designation usually refers to a specific spring force. This ensures constant pressure between the heat sink and the chip, which is vital for maintaining a consistent thermal interface. ### 4. Thermal Performance The efficiency of this part is measured by its **Thermal Resistance**. In an electronic system, lower resistance is better: * **Unducted Flow:** At low airflow (100 LFM), the resistance is roughly **4.72°C/W**. * **Ducted Flow:** Under high-velocity forced air (700 LFM), the resistance can drop as low as **1.47°C/W**, allowing the component to handle significantly higher power loads. --- ### Summary of Use This part is typically used on **PCBs** where a heat-generating component (like a motor driver or a small processor) requires active or passive cooling to prevent thermal throttling or hardware failure.