The part number **ATS-P2-167-C2-R0** refers to a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). This component belongs to their *push-pin* series, designed specifically for cooling electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the ATS-P2-167-C2-R0: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 9.10°C/W (at 100 LFM) | | **Pressure Drop** | 0.14 inH2O (at 100 LFM) | | **Heat Sink Type** | Straight Fin | --- ### 2. Physical Dimensions Precision measurements are critical for PCB layout and clearance planning: | Dimension | Value | | :--- | :--- | | **Length** | 45.00 mm | | **Width** | 45.00 mm | | **Height** | 10.00 mm | | **Fin Pitch** | High Density | | **Spring Type** | Brass | --- ### 3. Key Electronic Functions While the heat sink itself does not contain active electronics, its role in an electronic system is vital for reliability: * **Thermal Dissipation:** It increases the surface area of a semiconductor package, allowing heat to transfer more efficiently from the junction to the ambient air. * **Thermal Interface Material (TIM):** This specific model typically comes with a pre-applied **T766** thermal phase change material or tape, ensuring minimal air gaps between the chip and the aluminum base. * **Mechanical Stability:** The "P2" designation indicates a push-pin attachment with a specific compression force, ensuring constant contact pressure without damaging the PCB or the solder balls of a BGA (Ball Grid Array) package. --- ### 4. Part Number Breakdown The nomenclature follows the ATS standard coding system: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **P2**: Attachment style (Push-pin with specific spring tension). * **167**: Internal design/footprint code. * **C2**: Material/Finish (Blue Anodized Aluminum). * **R0**: Revision/Packaging code.