The **ATS-P2-155-C2-R0** is a high-performance electronic thermal management component, specifically a **push-pin heat sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power ASICs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 10.00mm | | **Attachment Type** | Push-Pin (Plastic or Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 12.11°C/W (Unducted Flow @ 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design and Components The part is engineered for efficiency in compact spaces. Here are its primary electronic/mechanical parts: #### A. Fin Geometry (Straight Fin) The heat sink utilizes a **straight fin** design. This is optimized for "ducted" or directional airflow, allowing air to pass through the channels with minimal resistance, effectively carrying heat away from the baseplate. #### B. Attachment System: Push-Pins and Springs Unlike adhesive-based heat sinks, this model uses a mechanical mounting system: * **Push-Pins:** These insert into pre-drilled holes on the PCB (Printed Circuit Board). * **Compression Springs:** These provide a precise "normal force" to ensure the heat sink stays in firm contact with the component, improving thermal transfer and preventing damage during vibration. #### C. Thermal Interface Material (TIM) The base comes pre-applied with **T766**, a high-performance thermal pad/paste. This fills the microscopic air gaps between the heat sink and the electronic chip, which is critical because air is a poor conductor of heat. --- ### 3. Application Use Cases This specific model is typically found in: * **Telecommunications:** Cooling high-speed networking chips. * **Embedded Systems:** Industrial PCs where mechanical stability is required. * **Power Supplies:** Cooling voltage regulators that generate significant heat in a small footprint. ---